박보인
- 전공
- 3D Monolithic Integration: Advanced packaging, Epitaxy, Layer transfer, thin-film device fabrication and Skin/Bio-electronics
- 직위(직급)
- 조교수
- 전화번호
- 063-270-2830
- 연구분야
- 3D Monolithic Integration: Advanced packaging, Epitaxy, Layer transfer, thin-film device fabrication and Skin/Bio-electronics
관심분야
학력
2017.03. – 2020.02. Ph.D. Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea
2013.03. – 2015.08. M.S. Department of Materials Science and Engineering, Korea University, Seoul, Republic of Korea
2013.03. – 2015.08. M.S. Department of Materials Science and Engineering, Korea University, Seoul, Republic of Korea
경력
2025.01. – present. Assistant Professor, Department of Semiconductor Science & Technology, Jeonbuk National University, Republic of Korea
2024.07. – 2024.12. CSO, M.O.P Materials Inc, Republic of Korea
2021.06. – 2024.07. Postdoctoral Researcher, Research Laboratory of Electronics / Department of Mechanical engineering, Massachusetts Institute of Technology (MIT)
2020.02. – 2021.04. Senior Researcher, Future Technology Research Center, SK hynix Inc., Republic of Korea
2016.03. – 2017.01. Researcher, Materials Architecturing Research Center, Korea Institute of Science and Technology (KIST), Seoul, Republic of Korea
2006.06. – 2008.12. Department of Technical, Good-morning Sindoh, Seoul, Republic of Korea
2003.02. – 2005.03. Department of Technical, Sindoh. Co., Ltd., Seoul, Republic of Korea
2024.07. – 2024.12. CSO, M.O.P Materials Inc, Republic of Korea
2021.06. – 2024.07. Postdoctoral Researcher, Research Laboratory of Electronics / Department of Mechanical engineering, Massachusetts Institute of Technology (MIT)
2020.02. – 2021.04. Senior Researcher, Future Technology Research Center, SK hynix Inc., Republic of Korea
2016.03. – 2017.01. Researcher, Materials Architecturing Research Center, Korea Institute of Science and Technology (KIST), Seoul, Republic of Korea
2006.06. – 2008.12. Department of Technical, Good-morning Sindoh, Seoul, Republic of Korea
2003.02. – 2005.03. Department of Technical, Sindoh. Co., Ltd., Seoul, Republic of Korea
연구업적
저서
대표논문
주저자 (2022~)
- Transferred graphene monolayer as a diffusion barrier for β-Ga2O3 based power devices, ACS Nano, 2025,19, 9, 8842–8851
- In-situ Formation of Porosity and Metallic Particles on Ti0.87O2 Nanosheets via Flash-Thermal Shock toward High Performance HCHO Sensing, Journal of Materials Chemistry A,2025, 13, 561-572
- Synergistic integration of electrical stimulation, reactive oxygen species regulation, and pro-angiogenic for accelerated wound healing, Nano Energy, 2024, 131, 110200
- Ultrahigh Photoresponsivity of W/Graphene/β-Ga2O3 Schottky Barrier Deep Ultraviolet Photodiodes, ACS Nano, 2024, 18, 8, 6558–6569
- Remote Epitaxy: Fundamentals, Challenges, and Opportunities, Nano letters, 2024, 24, 10, 2939–2952
- Remote epitaxial interaction through graphene, Science Advances, 2023, 9, eadj5379
- Advancing Perovskite Solar Cell Commercialization: Bridging Materials, Vacuum Deposition, and AI-Assisted Automation, Next Materials, 2024, 3, 100103
- Perovskite nanocomposites: synthesis, properties, and applications from renewable energy to optoelectronics, Nano Convergence, 2024, 11, 1, 1-22
공동참여 주요논문 (2022~)
- Precise relaxation time control with low energy loss through 2D materials in 2D/3D/2D heterostructures for giant energy density, Science, 2024, 384, 6693, 312-317
- Monolithic 3D integration of 2D materials-based electronics towards ultimate edge computing solutions, Nature Materials, 2023, Vol. 22, 1470-1477
- Vertical full-colour micro-LEDs via 2D materials-based layer transfer, Nature, 2023, Vol. 614, 81–87
- Non-epitaxial single-crystal 2D material growth by geometric confinement, Nature, 2023, Vol. 614, 88–94
- Graphene nanopattern as a universal epitaxy platform for single-crystal membrane production and defect reduction, Nature Nanotechnology, 2022, Vol. 17 (10), 1054-1059
- Chip-less wireless electronic skins by remote epitaxial freestanding compound semiconductors, Science
- Reconfigurable heterogeneous integration enabled by stackable chips with embedded artificial intelligence, Nature electronics, 2022, Vol. 5 (6), 386–393
- Transferred graphene monolayer as a diffusion barrier for β-Ga2O3 based power devices, ACS Nano, 2025,19, 9, 8842–8851
- In-situ Formation of Porosity and Metallic Particles on Ti0.87O2 Nanosheets via Flash-Thermal Shock toward High Performance HCHO Sensing, Journal of Materials Chemistry A,2025, 13, 561-572
- Synergistic integration of electrical stimulation, reactive oxygen species regulation, and pro-angiogenic for accelerated wound healing, Nano Energy, 2024, 131, 110200
- Ultrahigh Photoresponsivity of W/Graphene/β-Ga2O3 Schottky Barrier Deep Ultraviolet Photodiodes, ACS Nano, 2024, 18, 8, 6558–6569
- Remote Epitaxy: Fundamentals, Challenges, and Opportunities, Nano letters, 2024, 24, 10, 2939–2952
- Remote epitaxial interaction through graphene, Science Advances, 2023, 9, eadj5379
- Advancing Perovskite Solar Cell Commercialization: Bridging Materials, Vacuum Deposition, and AI-Assisted Automation, Next Materials, 2024, 3, 100103
- Perovskite nanocomposites: synthesis, properties, and applications from renewable energy to optoelectronics, Nano Convergence, 2024, 11, 1, 1-22
공동참여 주요논문 (2022~)
- Precise relaxation time control with low energy loss through 2D materials in 2D/3D/2D heterostructures for giant energy density, Science, 2024, 384, 6693, 312-317
- Monolithic 3D integration of 2D materials-based electronics towards ultimate edge computing solutions, Nature Materials, 2023, Vol. 22, 1470-1477
- Vertical full-colour micro-LEDs via 2D materials-based layer transfer, Nature, 2023, Vol. 614, 81–87
- Non-epitaxial single-crystal 2D material growth by geometric confinement, Nature, 2023, Vol. 614, 88–94
- Graphene nanopattern as a universal epitaxy platform for single-crystal membrane production and defect reduction, Nature Nanotechnology, 2022, Vol. 17 (10), 1054-1059
- Chip-less wireless electronic skins by remote epitaxial freestanding compound semiconductors, Science
- Reconfigurable heterogeneous integration enabled by stackable chips with embedded artificial intelligence, Nature electronics, 2022, Vol. 5 (6), 386–393