Development of Testing Methods for Measuring Material Properties
Metal thin films are extensively utilized in applications such as micro/nano devices, integrated circuits, and surface coatings. The micro/nano-scale structures employed in these devices differ from bulk materials due to distinct fabrication methods and the presence of size effects, making the direct application of bulk material properties to thin films inappropriate. Accurate characterization of the mechanical properties of thin films is crucial, as these properties directly influence the reliability and performance of devices during both fabrication and operation. However, the small scale of thin films poses significant challenges in measurement, particularly in specimen preparation, handling, and testing. Developing reliable testing methods for thin films is therefore essential to address these challenges and ensure the precision required for advanced applications.
In this study, we developed a membrane deflection experiment (MDE) to measure the tensile properties of thin films.Rather than applying tensile loads directly, tensile deformation was induced by subjecting the specimen to a vertical load. The strain and stress during the experiment were calculated using the following equations.
Using finite element analysis (FEA), we confirmed that the material properties obtained from the membrane deflection experiment (MDE) align with the actual material properties. We also measured the properties of various metal thin films, including gold, aluminum, and nickel-based alloys. Future research will aim to develop measurement techniques for a broader range of materials, extending beyond thin films.



